DEBONDING DEVICE FOR SEMICONDUCTOR MANUFACTURING

摘要

PROBLEM TO BE SOLVED: To provide a debonding device for semiconductor manufacturing.

SOLUTION: A debonding device comprises: a stage 110 on which a carrier wafer 10 formed using a temporary adhesive layer 30 applied on a surface is supported; a chuck 120 disposed so as to be able to approach or separate from the stage 110 above the stage 110 and chucking a chip stack assembly 20; an up/down drive unit 130 performing up/down drive on the chuck 120 in connection with the chuck 120; a slide unit 140 sliding the chuck 120 in a plate surface direction of the carrier wafer 10 in connection with the chuck 120; and a controller controlling the operation between the up/down drive unit 130 and the slide unit 140 so that the chip stack assembly 20 slides after the chip stack assembly 20 is subjected to an up operation with respect to the carrier wafer 10.

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