| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a marking which is applicable to an electronic component placed under a severe environment. <P>SOLUTION: A method of manufacturing an electronic component is provided, which includes an applying step (steps S4, S9) of applying ink 45 having light-curing property and containing ≥5 mass% and ≤20 mass% N-vinyl caprolactam onto a semiconductor chip 12 being the electronic component to perform marking, an irradiation step (S3-S6, S8-S11) of irradiating the applied ink 45 with light at a cumulative light dose of ≥200 mJ/cm<SP POS="POST">2</SP>, and a heating step (step S15) of heating the ink 45 at ≥150°C and ≤200°C after the irradiation step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
