| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a phenolic compound exhibiting low viscosity at 50°C and low moisture absorption, and exhibiting good mechanical properties when being reacted and cured with an epoxy resin. <P>SOLUTION: The phenolic compound is obtained by reacting phenols, an aromatic aldehyde compound and formaldehyde, wherein the aromatic aldehyde compound is used in 0.1 to 4.0 mol times the formaldehyde, and the viscosity at 50°C of the phenolic compound is 0.01 to 100 Pa s. <P>COPYRIGHT: (C)2013,JPO&INPIT |
