发明名称 FINGERPRINT SENSING ASSEMBLIES AND METHODS OF MAKING
摘要 A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
申请公布号 US2012257032(A1) 申请公布日期 2012.10.11
申请号 US201213455236 申请日期 2012.04.25
申请人 BENKLEY, III FRED G.;VALIDITY SENSORS, INC., A DELAWARE CORPORATION 发明人 BENKLEY, III FRED G.
分类号 H04N7/18;H05K13/00 主分类号 H04N7/18
代理机构 代理人
主权项
地址