| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding method by which the flow of current between adjacent electrode pads and between adjacent bonding wires can be prevented or can be suppressed as much as possible without increasing the size of a semiconductor device on which a semiconductor chip is mounted, and to provide a semiconductor device. <P>SOLUTION: A bonding wire W1 for a first electrode pad 3 and a bonding wire W2 for a second electrode pad 4 adjacent to the first electrode pad 3 are bonded at bonding points which are not adjacent to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
