POLYAMIDE COMPOUND AND EPOXY RESIN COMPOSITION CONTAINING SAME

摘要

Disclosed is a polyamide compound which is characterized by having a partial structure that is represented by general formula (I) and/or general formula (I') in a repeating unit. (In the formulae, X represents a hydrogen atom or a hydroxyl group.) Also disclosed is an epoxy resin composition which uses the compound as a curing agent. The polyamide compound is capable of providing an epoxy resin with high peel strength with respect to a surface that has low surface roughness, without increasing the amount of a filler blended therein.