| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent reduction in the reliability of a resin-sealed semiconductor device. <P>SOLUTION: In a semiconductor device, a cap (member) 2 and a cap (member) 5 having a cavity part (space formation part) 5d are superimposed and bonded together to form a sealed space 8, and a sensor chip (semiconductor chip) 1 and a plurality of wires 4 are disposed in the space 8. The semiconductor device is manufactured as follows: in a sealing step of sealing a joint part between the cap 2 and the cap 5, a sealant 9 composed of a resin is formed such that the entirety of an upper surface 5a of the cap 5 and the entirety of a lower surface 2b of the cap 2 are respectively exposed. Thus, in the sealing step, the pressure acting in the direction of crushing the cap 5 can be decreased. <P>COPYRIGHT: (C)2013,JPO&INPIT |
