| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify a sealing process for a connection part between each flexible substrate and each mount terminal of an electro-optic substrate in which a plurality of data line control circuits are mounted by a COF method, and avoid increase in thickness of the entire electro-optic substrate. <P>SOLUTION: A terminal part is provided along a side of an electro-optic substrate in a direction of a scan line, and first and second mount terminals for connecting first and second flexible substrates including data line control circuits are arranged in a direction of extracting data lines. In a sealing step of applying a resin for sealing a bonding part between the first flexible substrate and the first mount terminal and a bonding part between the second flexible substrate and the second mount terminal, the resin is applied so that parts of the former bonding part and the latter bonding part that face each other are sealed with a common resin member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
