发明名称 RADIATION-CURABLE TYPE ADHESIVE COMPOSITION, ADHESIVE TAPE FOR WAFER PROCESSING BY USING THE SAME, AND METHOD FOR DISCRIMINATING RADIATION-CURABLE TYPE ADHESIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation-curable type adhesive composition that has a crosslinked structure of an acrylic-based polymer which includes therein a movable molecule such as a radiation-curable type compound and besides which has little fluctuation in pick-up characteristics caused by the temperature during transportation or custody, and that has a disperse state of the radiation-curable type compound. <P>SOLUTION: This radiation-curable type adhesive composition includes an acrylic-based polymer, a radiation-curable type compound, a crosslinker, and a photopolymerization initiator, characterized in that the maximum calorific peak temperature in measurement by a differential scanning calorimetry (DSC) is from 140&deg;C or above and less than 180&deg;C, and the shift magnitude at the maximum calorific peak temperature on the DSC after the treatment at 60&deg;C for 24 hours is within 30&deg;C. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012193321(A) 申请公布日期 2012.10.11
申请号 JP20110060125 申请日期 2011.03.18
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 IIDA YASUHIRO
分类号 C09J133/00;C09J4/06;C09J7/02;C09J11/06;H01L21/301 主分类号 C09J133/00
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