发明名称 COATING FILM FORMATION APPARATUS AND COATING FILM FORMATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To form a coating film on a processed substrate without causing coating spots, reduce the cost, and improve the production efficiency. <P>SOLUTION: A coating film formation apparatus includes: nozzle moving means 20 moving a nozzle 16 relative to a substrate G on a substrate conveyance path; and control means 50 performing drive control of the nozzle and the nozzle moving means. The control means places the nozzle at a coating start region of the substrate through the nozzle moving means and discharges a processing liquid R from a discharge port of the nozzle to apply the processing liquid R to the substrate in the coating start region. Further, the control means moves the nozzle for a predetermined distance in the scanning direction through the nozzle moving means in the coating start region. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012195532(A) 申请公布日期 2012.10.11
申请号 JP20110060169 申请日期 2011.03.18
申请人 TOKYO ELECTRON LTD 发明人 WAKAMOTO YUKIHIRO
分类号 H01L21/027;B05C5/02;B05D1/26 主分类号 H01L21/027
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