| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus in which, by efficiently converting light energy into thermal energy, a substrate is heated only during heat treatment of the substrate, and loss of energy is suppressed by stopping heating in a period of time during which the substrate is not treated. <P>SOLUTION: The heat treatment apparatus includes: a heat source 50 equipped with a plurality of light-emitting diodes 53 for emitting light of a wavelength which can heat a wafer W; and a heat exchanger plate 40 which is heated by the light emitted from the heat source 50 and transmits the heat to the wafer W. On the surface opposite to the heat source of the heat exchanger plate 40, an antireflection layer, for example, an uneven surface 47 is formed which suppresses reflection of the light emitted from the light-emitting diodes 53. <P>COPYRIGHT: (C)2013,JPO&INPIT |
