Integrated Circuit Package Security Fence

摘要

Embodiments of an integrated circuit package security fence are provided. The integrated circuit package includes a substrate, a die, and a security fence coupled to the substrate such that the die is located between the security fence and the substrate. The security fence includes a first signal net having a plurality of bonding wires and a second signal net having a second plurality of bonding wires. The bonding wires of the first signal net and second signal net are arranged in a pattern to overlap the top surface of die. The die may include tamper detection logic to detect attempt to access the die through the security fence.