Producing substrate ribbon for high-temperature superconductors, comprises shaping non-ferromagnetic or weakly ferromagnetic metallic carrier material, and applying an interfacial layer before plating on the carrier material

摘要

The process comprises shaping a non-ferromagnetic or weakly ferromagnetic metallic carrier material (B) having a strong textured metallic covering layer (A) to form a metal composite by mechanical plating, and applying an interfacial layer (C) before plating on the carrier material. A connection of the carrier material with the covering layer is carried out by roll cladding. The metal composite is subjected to a cold-rolling. The carrier material and the covering layer are formed as a film of predeterminable thickness and width. Each covering layer is formed with a cube texture (W). The process comprises shaping a non-ferromagnetic or weakly ferromagnetic metallic carrier material (B) having a strong textured metallic covering layer (A) to form a metal composite by mechanical plating, and applying an interfacial layer (C) before plating on the carrier material. A connection of the carrier material with the covering layer is carried out by roll cladding. The metal composite is subjected to a cold-rolling. The carrier material and the covering layer are formed as a film of predeterminable thickness and width. Each covering layer is formed with a cube texture (W). A finished rolled metal composite is subjected to a single-step heat treatment. An independent claim is included for a substrate ribbon for high-temperature superconductors.