发明名称 Ni-W ELECTROFORMING SOLUTION FOR MOLDING DIE, METHOD FOR PRODUCING MOLDING DIE, MOLDING DIE, AND METHOD FOR PRODUCING MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a Ni-W electroforming solution for a molding die which is excellent in releasability, heat resistance and workability, allows an enlargement of the area, and has low production cost and environmental load, and to provide a method for producing a molding die, a molding die, and a method for producing a molded article. <P>SOLUTION: The Ni-W electroforming solution for a molding die is used when a molding die, used for molding a molded article having a surface with a rugged pattern, is produced by electroforming. The Ni-W electroforming solution includes at least nickel sulfamate and sodium tungstate in a total amount of 0.40 mol/L, and the nickel sulfamate in an amount of 0.04-0.20 mol/L. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012193395(A) 申请公布日期 2012.10.11
申请号 JP20110056385 申请日期 2011.03.15
申请人 KANAGAWA PREFECTURE;LEAP CO LTD 发明人 YASUI MANABU;HIRABAYASHI YASUO;KANEKO SATOSHI;KITAOKA FUMIAKI;HIROSE MASAAKI
分类号 C25D1/00;C03B11/00;C25D7/00 主分类号 C25D1/00
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