发明名称 LIQUID EJECTION HEAD, IMAGE FORMING APPARATUS AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem that, when electroforming a diaphragm member, the height of a projecting portion joined to a piezoelectric member is not secured if the overhang-shaped portions of the projecting portion are made small in size, then, a joint area becomes narrower, and responsiveness becomes worse if the thin thickness portion is made narrower. <P>SOLUTION: Regarding a second layer 2b and a third layer 2c being a two-step electroformed film constituting the projecting portion 2B of the diaphragm member 2, both the layers include the overhang-shaped portions 101 and 102 where pattern edges are formed to overhang the thin thickness portion (first layer) 2a. In a cross section in a direction along the stacking direction of the second layer 2b and the third layer 2c, the side (opposed surface) 102a opposed to the arched outer peripheral surface 101a of the overhang-shaped portion 101 of the second layer 2b (first-step electroformed film) of the overhang-shaped portion 102 of the third layer 2c (second-step electroformed film) is formed to have an arched shape, and also, the tip 102b of the second-step overhang-shaped portion 102 is located close to the thin thickness portion 2a from a connection portion 112 between the third layer 2c and the second layer 2b. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012192709(A) 申请公布日期 2012.10.11
申请号 JP20110060180 申请日期 2011.03.18
申请人 RICOH CO LTD 发明人 HIRATSUKA YUDAI
分类号 B41J2/045;B41J2/055;B41J2/16 主分类号 B41J2/045
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