| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin semiconductor device manufacturing method which can prevent breakage of the thin semiconductor device in a process and the like of thinning a substrate of the semiconductor device, and to provide a fragile member support medium which is preferably used to prevent breakage of a fragile member such as a semiconductor substrate during manufacturing, transportation, and the like. <P>SOLUTION: A manufacturing method of a thin semiconductor device in which circuit elements are formed on a semiconductor substrate, comprises: a process of bonding a surface of the semiconductor substrate on which the circuit elements are formed with a bonding surface of a support substrate; a process of forming a specific separation layer in the support substrate; a process of separating and removing a portion on the side of the support substrate, which does not face the circuit elements, by cleaving the support substrate at the separation layer; and a process of peeling and removing a portion on the side of the support substrate, which faces the circuit elements. A fragile member support medium includes the support substrate and an adhesive layer adjacent to the support substrate, and the support substrate has the specific separation layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
