MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGE AND THE ELECTRONIC COMPONENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component package which reduces both its thickness and area.

SOLUTION: In an electronic component package, posts 54 are used as external connection terminals and an electronic component 56 is mounted on a second resin layer 58. A conductor pattern is sealed in the second resin layer 58, and the electronic component 56 is provided on one surface of the second resin layer 58. The posts 54 are provided on the one surface of the second resin layer 58 which is located close to the circumferential edge side relative to the electronic component 56. The posts 54 and electrode terminals 56a of the electronic component 56 directly and electrically connect with the conductor pattern 64.

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