<p>An LED structure and the manufacturing method thereof are disclosed. The LED structure includes a shell (11), an LED chip (14) and a transparent package part (15). The shell 11 includes a recess (111) and at least a convex (16). The LED chip (14) is set in the recess (111). The rims of the transparent package part (15) match the recess (111). The transparent package part (15) is covering the LED chip (14) in the recess (111). The height of the transparent package part (15) is less than the height of the surface of the boss (55a). The LED chip (14) of the LED structure in the invention enlarges the emitting angle and improves the radiation efficiency by the spherical surface of the transparent package part (15).</p>
申请公布号
WO2012136009(A1)
申请公布日期
2012.10.11
申请号
WO2011CN72813
申请日期
2011.04.14
申请人
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.;CHANG, KUANGYAO;HU, CHECHANG;ZHANG, JING