| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component capable of suppressing deterioration of insulation resistance caused by Ag migration and effectively manufacturing a highly reliable electronic component when manufacturing the electronic component having an external electrode including an Ag electrode, and Ni plating film and Au plating film for covering the Ag electrode. <P>SOLUTION: The Ni plating film is formed on the surface of the external electrode body consisting of a material including Ag as a main component. Then, after the Au plating film is formed on the surface of the Ni plating film, etching is performed by using an etching liquid which selectively dissolves Ag. As the etching liquid, an etching liquid containing at least one substance selected from a group consisting of an iron (III) salt, hydrogen peroxide, and ammonium peroxodisulfate is used. Furthermore, an etching liquid containing iron (III) ammonium sulfate is used as the etching liquid. The etching liquid used has a pH value of 1.0 or more. <P>COPYRIGHT: (C)2013,JPO&INPIT |
