| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus with reduced atmosphere opening time and improved throughput. <P>SOLUTION: A substrate processing apparatus 1 comprises: a chamber 11; a stage 12 which is arranged in the chamber and on which a substrate 2 is plated; gas supply means 13 for introducing a prescribed gas into the chamber through a gas supply line 13a; a pressure sensor 15 which detects a pressure P<SB POS="POST">1</SB>in the chamber; and control means 16 for controlling an introduction pressure P<SB POS="POST">2</SB>of the gas. When the gas supply means introduces the prescribed gas into the chamber with the introduction pressure P<SB POS="POST">2</SB>to return a pressure in a load lock chamber to an atmospheric pressure (atmosphere opening) from a vacuum state, the pressure sensor detects the pressure P<SB POS="POST">1</SB>in the chamber and the control means controls the introduction pressure P<SB POS="POST">2</SB>for the pressure P<SB POS="POST">1</SB>so that the difference between the P<SB POS="POST">2</SB>and the P<SB POS="POST">1</SB>substantially becomes constant. <P>COPYRIGHT: (C)2013,JPO&INPIT |
