| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for hardening an ink after applying the ink on an aperture of a patterning substrate, in which the ink is hardened in a flat shape when evaporated and dried in a partition wall, and high quality printed matter can be obtained. <P>SOLUTION: Disclosed is a method for flattening/hardening an ink in an aperture of a patterning substrate, in which, after applying an ink 203 on an aperture 202 of a transparent patterning substrate 200 having a partition wall 201 and the aperture 202, the applied ink is flattened and hardened. The surface of the ink 203 is flattened then dried and hardened while electrically pulling up the center part of the liquid layer surface on the interface of a gas layer-liquid layer of the ink 203 applied on the aperture by potential difference (electric field) between metal plates 204A, 204B. <P>COPYRIGHT: (C)2013,JPO&INPIT |
