| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for applying an adhesive, while keeping an application amount constant, in a minute adhesion domain of several tens of micrometers without using high-precision control or printing technique, in a process etc. for performing the bonding of a minute part to manufacture a MEMS device. <P>SOLUTION: The adhesive transfer method, provided with an application base material that has a film on which an adhesive agent pool is formed, with respect to a base material that has a base material surface and an applied surface to which the adhesive is applied on the base material surface, a transferred base material that has a transfer surface to which the adhesive applied on the applied surface is transferred, and a bonded base material to which the adhesive pooled in the adhesive agent pool is transcribed, includes: an application process for applying the adhesive to the applied surface; a transfer process for transferring the adhesive applied to the applied surface to the transfer surface by contacting the transfer surface with the applied adhesive; and an adhesive transcribing process for transcribing the adhesive pooled in the adhesive agent pool to the bonded base material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
