SEMICONDUCTOR DEVICE PACKAGE INCLUDING A PASTE MEMBER

摘要

A semiconductor device package is provided. The semiconductor device package comprises a package body; a plurality of electrodes comprising a first electrode on the package body; a paste member on the first electrode and comprising inorganic fillers and metal powder; and a semiconductor device die-bonded on the paste member, wherein a die-bonding region of the first electrode comprises a paste groove having a predetermined depth and the paste member is formed in the paste groove.