| 摘要 |
A circuit module includes a multilayer substrate including built-in capacitors and external components mounted on the surface of the multilayer substrate. On the surface of a dielectric layer, an auxiliary electrode is provided. The auxiliary electrode is electrically connected to a capacitor electrode via a via electrode passing through the dielectric layer. On the surface of a dielectric layer, a capacitor electrode is arranged so as to face the capacitor electrode and the auxiliary electrode connected to the capacitor electrode. The auxiliary electrode is arranged in an area in which the capacitor electrodes overlap each other as viewed from a lamination direction.
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