发明名称 |
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD |
摘要 |
PURPOSE: A plasma processing apparatus supplying high frequency power and a plasma processing method are provided to apply a voltage to high frequency power and a sample which generates plasma by providing intermittent high frequency power which is controllable in a wide repetition frequency band with high precision. CONSTITUTION: A shower plate(102) and a dielectric window(103) for introducing etching gas in a vacuum container(101) is formed on the top of the vacuum container having an opened top portion. A gas supply device(105) letting the etching gas flow is connected to the shower plate. A vacuum evacuator(106) is connected to the vacuum container passing through an on off valve(117) for ventilation and an exhaust rate variable valve(118). A process chamber(104) becomes a vacuum state by driving the vacuum evacuator. Pressure in the process chamber is adjusted to desired pressure by the exhaust rate variable valve. A sampling electrode(111) is installed in a lower part of the vacuum container facing the shower plate. [Reference numerals] (105) Gas supply device; (113) Matching circuit; (114) High frequency bias power; (115) High frequency filter; (116) DC; (120) Control part |
申请公布号 |
KR20120111867(A) |
申请公布日期 |
2012.10.11 |
申请号 |
KR20110075140 |
申请日期 |
2011.07.28 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORPORATION |
发明人 |
MORIMOTO MICHIKAZU;OHGOSHI YASUO;OOHIRABARU YUUZOU;ONO TETSUO |
分类号 |
H05H1/46;H01L21/3065 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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