| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure sufficient heat dissipation when packaging a semiconductor device having a structure in which a rear face of a die pad is not covered with a resin sealing body. <P>SOLUTION: A semiconductor device 50 comprises: a semiconductor chip 2; a die pad 1 on which the semiconductor chip 2 is mounted; a plurality of leads 7 electrically connected with the semiconductor chip 2; and an encapsulation body 10 resin encapsulating the semiconductor chip 2 on the die pad 1. A plurality of plating layers including a first plating layer 3 and a second plating layer 4 of a material different from that of the first plating layer 3 are formed on a rear face of the die pad 1 opposite to a face on which the semiconductor chip 2 is mounted. The second plating layer 4 is formed to include a region different from that of the first plating layer 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
