发明名称 SUBSTRATE TRANSFER DEVICE, SUBSTRATE TRANSFER METHOD AND SUBSTRATE PROCESSING DEVICE
摘要 <p>PURPOSE: A substrate transfer device, a substrate transfer method, and a substrate processing device are provided to reduce time for transferring a substrate by calculating arrival time of a holding support member to a substrate transferring position. CONSTITUTION: A substrate transfer device(13) transfers a wafer(W) between a carry-in/out stage(12) and load-lock chambers(14,15). Two loading tables(16a,16b) respectively loading the wafer are installed within the load-lock chamber. A vacuum transfer chamber(1) is installed on a rear side of the load-lock chamber. A transfer arm(20) comprises a bottom arm member(21), a middle arm member(22), and a top arm member(23). Process chambers(301-303) are formed by a processing container of a vacuum process module.</p>
申请公布号 KR20120112212(A) 申请公布日期 2012.10.11
申请号 KR20120032924 申请日期 2012.03.30
申请人 TOKYO ELECTRON LIMITED 发明人 MIYASHITA TETSUYA;HARA MASAMICHI
分类号 H01L21/677;B65G49/07;H01L21/683 主分类号 H01L21/677
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