发明名称 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTORESIST FILM, FORMATION METHOD OF RESIST PATTERN AND FORMATION METHOD OF CONDUCTOR PATTERN USING THE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has good resolution and adhesion, ensures a very small trail of a cured resist after development, and also has good detachability; and a photoresist film including a photosensitive resin composition layer composed of the photosensitive resin composition and a support layer. <P>SOLUTION: Provided is a photosensitive resin composition containing (A) binder polymer, (B) photopolymerizable monomer having an amino group, (C) photopolymerization initiator, and (D) benzotriazole derivative having a carboxyl group. Also provided is a photoresist film including a photosensitive resin composition layer composed of the photosensitive resin composition and a support layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012194552(A) 申请公布日期 2012.10.11
申请号 JP20120042872 申请日期 2012.02.29
申请人 NICHIGO MORTON CO LTD 发明人 TOYODA DAIKI
分类号 G03F7/027;C08F2/44;C08F2/50;C08F265/00;G03F7/004;H05K3/06;H05K3/18 主分类号 G03F7/027
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