| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which inhibits peeling between an insulation layer and shield electrodes while maintaining shield performance. <P>SOLUTION: Electronic components 12, 13 are incorporated into a laminated body including a flexible insulation layer 17 and a conductor layer 51. Shield electrodes 16 shielding the incorporated electronic components 12, 13 are disposed so as to be dispersed in multiple layers. First shield electrodes 16a located near the electronic components 12, 13, from among the shield electrodes 16, are located in positions where the electronic components 12, 13 are located when viewed in the lamination direction. Second shield electrodes 16b located in positions further from the electronic components 12, 13 compared to the first shield electrodes 16a are located so as to cover regions other than the regions covered by the first shield electrodes 16a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
