| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode having high luminous efficiency and high reliability. <P>SOLUTION: A reflective layer 13 is formed on an upper surface side of a first lead frame 111 and a second lead frame 112. A light emitting diode chip 14 is mounted on the second lead frame 112. Two electrodes in the light emitting diode chip 14 are connected to the first lead frame 111 and the second lead frame 112 via two bonding wires 15, respectively. A maximum height of the reflective layer 13 is higher than a top face of the light emitting diode chip 14, and the reflective layer 13 consists of a sidewall part 131 annularly surrounding a circumference of the light emitting diode chip 14 and a bottom surface part 132 of substantially flat face shape formed at the bottom of the interior of the sidewall part 131 and having a maximum height being lower than the top face of the light emitting diode chip 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
