| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus and a method for forming a thin film, capable of forming a thin film having a uniform thickness on a large-area substrate while highly efficiently using a thin film material. <P>SOLUTION: The vacuum deposition apparatus 10a includes: evaporation sources 31-36 which generate vapor of the thin film material; a vacuum tank 11 in which a film forming object 51 is disposed; an evacuation device 12 which evacuates the inside of the vacuum tank 11; and a release device 21 to which the vapor is supplied from the evaporation sources 31-36 and which releases the vapor into the vacuum tank 11, in which the vapor is brought to the film forming object 51 while moving the release device 21 to form a thin film on the surface of the film forming object 51. The apparatus 10a further includes a moving device 15 for moving the evaporation sources 31-36 together with the release device 21. <P>COPYRIGHT: (C)2013,JPO&INPIT |
