SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a semiconductor device which simultaneously solders a semiconductor chip and lead frames on an insulating circuit board by one-time reflow soldering, and does not cause a change in the positions of the lead frames, which lead to the outside. A power semiconductor chip and a control IC are mounted on the insulating circuit board (S15), and after positioning the lead frames on the insulating circuit board (S16), the semiconductor chip and the lead frames are simultaneously soldered on the insulating circuit board by one-time reflow soldering (S17). In addition, primary bending is performed on the lead frames (S20), and after a terminal case has been attached to the insulating circuit board (S21), secondary bending is performed on the lead frames (S22).