LIGHT EMITTING DIODE PACKAGE STRUCTURE

摘要

Provided is a light emitting diode package structure(10), which comprises: a shell(11), a light emitting diode chip(14) and a transparent package part(15). The shell includes a concave part(111) and multiple convex parts(16). The light emitting diode chip is disposed in the concave part and covered by the transparent package part. The multiple convex parts are disposed in the concave part or disposed on the edge of the shell. By the multiple convex parts, the transparent package part is formed to include a surface with sags and crests, so as to enlarge diffusion angle of light and enhance light-emitting efficiency.