CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A ceramic substrate and a manufacturing method thereof are provided to greatly reduce manufacturing costs and manufacturing time of the ceramic substrate by forming a through hole corresponding to a via using single molding. CONSTITUTION: A plurality of vias(11) is arranged on the center of a ceramic substrate(13). The plurality of vias passes the ceramic substrate through a thickness direction. A pad(19) is formed outside a center portion on which the via is formed. A conductive layer(21) connects the via and the pad. The conductive layer is formed on a surface of the ceramic substrate.