| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus of a substrate which can cool the substrate after heat treatment and is inexpensive with a simple structure. <P>SOLUTION: When a pair of wafer transfer arms 20, 20 are elevated up to an upper position while still in a retreating position after completion of heat treatment of a wafer W, the wafer transfer arms 20, 20 push up the lower surface of a soaking ring 10 supporting the wafer W. As a result thereof, the wafer W is elevated to the position close to an upper furnace wall 80a by within 3 mm in a heat treatment furnace 80 and quickly cooled by heat transfer or the like due to opposition to the upper furnace wall 80a in a low-temperature state. <P>COPYRIGHT: (C)2013,JPO&INPIT |
