发明名称 |
SHORT AND LOW LOOP WIRE BONDING |
摘要 |
A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.
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申请公布号 |
US2012256314(A1) |
申请公布日期 |
2012.10.11 |
申请号 |
US201113228319 |
申请日期 |
2011.09.08 |
申请人 |
HAR LIEW SIEW;LING LAW WAI;CARSEM (M) SDN.BHD. |
发明人 |
HAR LIEW SIEW;LING LAW WAI |
分类号 |
H01L23/49;B23K31/02;H01L21/60;H01L23/492 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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