| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which is particularly favorable for vehicle glass applications, and has superior adhesion strength to glass, acid resistance, salt water resistance, and temperature cycle resistance. <P>SOLUTION: The lead-free solder alloy for vehicle glass comprises an alloy composition of 26.0 to 56.0 mass% of In, 0.1 to 5.0 mass% of Ag, 0.002 to 0.05 mass% of Ti, and 0.001 to 0.01 mass% of Si, the remainder being Sn. Furthermore, the alloy may contain 0.005 to 0.1 mass% of Cu and 0.001 to 0.01 mass% of B. <P>COPYRIGHT: (C)2013,JPO&INPIT |
