| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus including a tray provided with a holding part on a principal surface so as to support a substrate in a partially protruding state and surround the substrate in contact with a lateral face of the substrate. <P>SOLUTION: A semiconductor manufacturing apparatus 100 comprises: a chamber 101 performing processing treatment; a susceptor 102 having one flat surface 102S; and one tabular tray 103 placed such that one principal surface 103S contacts and overlaps the one surface 102S of the susceptor 102. A plurality of wafer-shaped substrates 104 are placed on another principal surface 103T of the tray. The shape of the tray 103 is regulated such that a part of an untreated surface 104B of the substrate 104 forms at least a region R2 not contacting the other principal surface 103T of the tray. In a region among the other principal surface 103T of the tray, where the untreated surface 104B of the substrate does not contact, a holding part 105 of the substrate is provided so as to surround the substrate in contact with the lateral face of the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
