发明名称 SANDWICH MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a sandwich molding containing a polyamide resin. <P>SOLUTION: In the sandwich molding, (1) a skin layer 1 contains the polyamide resin, an epoxy compound, and glass fibers, (2) the content of the epoxy resin in the skin layer 1 is 0.2-2 pts.mass per 100 pts.mass of the polyamide resin, (3) the melt viscosity &eta;a of a resin composition in the skin layer 1 measured at a temperature of ((the melting point of the polyamide resin)+30)&deg;C and at a shear rate of 1,000 s<SP POS="POST">-1</SP>is 300-2,000 Pa s, (4) the mixing ratio of the resin composition and the glass fibers in the skin layer 1 is 40/60-70/30 in mass ratio, (5) a core part 2 contains the polyamide resin and the glass fibers having a mean fiber length of 0.5-5 mm and longer fiber lengths, and (6) the mixing ratio of the polyamide resin and the glass fibers in the core part 2 is 30/70-60/40 in mass ratio. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012192527(A) 申请公布日期 2012.10.11
申请号 JP20110056054 申请日期 2011.03.15
申请人 UNITIKA LTD 发明人 NEGI YUKINARI
分类号 B29C45/16 主分类号 B29C45/16
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