| 发明名称 |
LIGHT-EMITTING DIODE PACKAGE |
| 摘要 |
A light-emitting diode (LED) package including a substrate, an LED chip, a polarizer, and a supporter is provided. The LED chip is disposed on the substrate. The polarizer is disposed above the LED chip. The supporter is disposed on the substrate for supporting the polarizer.
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| 申请公布号 |
US2012256217(A1) |
申请公布日期 |
2012.10.11 |
| 申请号 |
US201113274159 |
申请日期 |
2011.10.14 |
| 申请人 |
LI YUET-WING;FAN-CHIANG KUAN-HSU;HO SIN-HUA;HIMAX TECHNOLOGIES LIMITED;HIMAX DISPLAY, INC. |
发明人 |
LI YUET-WING;FAN-CHIANG KUAN-HSU;HO SIN-HUA |
| 分类号 |
H01L33/44 |
主分类号 |
H01L33/44 |
| 代理机构 |
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