发明名称 |
ADHESION PROMOTION OF METAL TO LAMINATE WITH A MULTI-FUNCTIONAL COMPOUND |
摘要 |
An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof. |
申请公布号 |
EP2274460(B1) |
申请公布日期 |
2012.10.10 |
申请号 |
EP20090723171 |
申请日期 |
2009.03.23 |
申请人 |
ENTHONE, INC. |
发明人 |
ABYS, JOSEPH, A.;ANTONELLIS, THEODORE;SUN, SHENLIANG;WALCH, ERIC;OWEI, ABAYOMI I.;RASMUSSEN, JEAN |
分类号 |
C23C22/52;C23C28/00;C23F1/18;C23F11/14;H05K3/38 |
主分类号 |
C23C22/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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