| 摘要 |
PURPOSE: A semiconductor element unloading apparatus and method are provided to rapidly unload semiconductor elements to be tasted without congestion. CONSTITUTION: An unloading apparatus(300) comprises an unloader unit(310), a first buffer unit(320), a first unloading transport unit(330), a second buffer unit(340), a second unloading transport unit(350), and a third unloading transport unit(370). The unloader unit unloads a test tray in which a plurality of semiconductor elements to be tested is accepted from a test position. The first buffer unit arranges a first buffer tray. The first unloading transport unit transfers the semiconductor elements accepted in the test tray to the first buffer tray. The second buffer unit arranges a second buffer tray. The second unloading transport unit transfers the semiconductor elements which are a target for re-test to the second buffer tray. The third unloading transport unit transfers good semiconductor elements remaining in the first buffer tray and the semiconductor elements remaining in the first buffer tray to customer tray as the divided state. |
