发明名称 |
Solid-state image pickup element, method of manufacturing the same, and electronic apparatus using the same |
摘要 |
Disclosed herein is a solid-state image pickup element (10), including a plurality of pixels (12) each having a photoelectric conversion portion (PD) for converting a quantity of incident light into an electric signal, and a plurality of pixel transistors (Tr); wiring layers (31,33,34) formed on one surface side of a semiconductor substrate (30) having the plurality of pixels (12) formed therein, a light made incident from a side opposite to the one surface having the wiring layers (31,33,34) formed thereon being received by corresponding one of the photoelectric conversion portions (PD); a scribe line (20) formed in a periphery of a pixel portion (13) composed of the plurality of pixels (12); and square-shaped termination detecting portions (21) each having higher hardness than that of the semiconductor substrate (30) and formed in the scribe line (20); wherein each of the square-shaped termination detecting portions (21) has a side parallel with a direction of the scribe line (20) of the semiconductor substrate (30). |
申请公布号 |
EP2226843(B1) |
申请公布日期 |
2012.10.10 |
申请号 |
EP20100154775 |
申请日期 |
2010.02.26 |
申请人 |
SONY CORPORATION |
发明人 |
ENOMOTO, TAKAYUKI;NAKAZAWA, KEIICHI |
分类号 |
H01L27/146;H01L21/301;H01L21/78;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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