| 摘要 |
PURPOSE: A low power semiconductor chip of a small outline package type is provided to reduce a surface area and volume of packaged chips and to reduce power consumption and standby power. CONSTITUTION: An SoP chip(1000) stores a signal transmitted from an external terminal. A pattern unit connects the external terminal and the SoP chip. The SoP chip includes a function unit(100) and a USB port pattern(200). An MPU chip(112), a DSP chip(114), a RAM chip(116), an I/O Power(118), a memory chip(120), and passive elements are implement as one package. [Reference numerals] (110) Processor module; (112) MPU chip; (114) DSP chip; (116) RAM chip; (120) Memory module; (130) Passive devices; (200) USB port pattern
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