发明名称 SEALING MACHINE FOR FILMS
摘要 PURPOSE: A film bonding apparatus is provided to bond and cut films at a right position by maintaining the films in a tensed state with first and second transferring devices. CONSTITUTION: A film bonding apparatus comprises a heater(10), a first transferring device(20), and a second transferring device(40). The heater heats films in a pressed state to bond the films. The first transferring device is arranged between film materials and the heater and supplies the films releasing from the film materials to the heater. The second transferring device transfers the films bonded by the heater by pulling the films. The first and second transferring devices are controlled to compensate the length of the extended films due to the heater.
申请公布号 KR20120111421(A) 申请公布日期 2012.10.10
申请号 KR20110029875 申请日期 2011.03.31
申请人 ESDWORK CO., LTD. 发明人 SONG, KEUK REOUL;JUNG, KYENG HO;HWANG, YONG GU
分类号 B31B1/64;B29C65/18;B31B1/04;B31B1/16 主分类号 B31B1/64
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