| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device that is improved in binding characteristics of junctions and improved in reliability. <P>SOLUTION: The solid-state imaging device includes a semiconductor substrate 101, on which a plurality of solid-state imaging elements are formed, and a light-transmissive member 201 mounted on the surface of the substrate 101 so that the member 201 have voids that correspond to the light-receiving regions of the imaging elements. At the junction, at least one side of surfaces abutting against one another has concave portions. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
