| 摘要 |
Provision of a probe device, a processing device and a probe test capable of performing an efficient wafer probe test. A probe device, comprising a plurality of measuring stages to which a plurality of probe cards for inspecting semiconductor wafers are connected, respectively; a first conveying portion for conveying a semiconductor wafer to a first measuring stage to which a first probe card is connected; a first inspection control portion for controlling the inspection of the semiconductor wafer by the first probe card; a receiving portion for receiving stage information including information showing nonuse of the first measuring stage from a processing device; a second conveying portion for conveying the semiconductor wafer to a second measuring stage, to which a second probe card different from the first probe card is connected, according to the received stage information; and a second inspection control portion for controlling the inspection of the semiconductor wafer by the second probe card. |
