发明名称 Integrated circuit system with metal and semi-conducting gate
摘要 A method for forming an integrated circuit system is provided including forming a semi-conducting layer over a substrate, forming a spacer stack having a gap filler adjacent to the semi-conducting layer and a inter-layer dielectric over the gap filler, forming a transition layer having a recess over the semi-conducting layer and adjacent to the spacer stack, and forming a metal layer in the recess.
申请公布号 US8283718(B2) 申请公布日期 2012.10.09
申请号 US20060611856 申请日期 2006.12.16
申请人 HUI ANGELA T.;CHANG MARK S.;CHANG KUO-TUNG;BELL SCOTT A.;SPANSION LLC;ADVANCED MICRO DEVICES, INC. 发明人 HUI ANGELA T.;CHANG MARK S.;CHANG KUO-TUNG;BELL SCOTT A.
分类号 H01L29/792 主分类号 H01L29/792
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