The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate.
申请公布号
US8284016(B2)
申请公布日期
2012.10.09
申请号
US20090627577
申请日期
2009.11.30
申请人
RYU HEUNG BOK;PARK JANG HO;KIM YOUNG KEY;SUH KI WON;CHOI YUN GAB;SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
RYU HEUNG BOK;PARK JANG HO;KIM YOUNG KEY;SUH KI WON;CHOI YUN GAB