发明名称 Lighting device and method of manufacturing the same
摘要 A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials. Also, a lighting device includes the metal substrate, an anode and cathode electrode of the LED chip disposed on the metal substrate and brazing materials connecting the LED chip and the metal substrate. Further, a slit is formed in the metal substrate between the anode and cathode electrode. Forming the slit in the metal substrate can prevent an occurrence of a crack in the brazing materials.
申请公布号 US8283681(B2) 申请公布日期 2012.10.09
申请号 US20100905855 申请日期 2010.10.15
申请人 SAKAMOTO NORIAKI;TANAHASHI NAOKI;HASEGAWA TSUYOSHI;KUSABE TAKAYA;MIZUTANI MASAHIKO;MIZUHARA HIDEKI;SAKUMA YOSHINARI;SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD. 发明人 SAKAMOTO NORIAKI;TANAHASHI NAOKI;HASEGAWA TSUYOSHI;KUSABE TAKAYA;MIZUTANI MASAHIKO;MIZUHARA HIDEKI;SAKUMA YOSHINARI
分类号 H01L29/18 主分类号 H01L29/18
代理机构 代理人
主权项
地址